Micron is hiring for Mechanical Engineer

The job you are looking for is no longer available..

Job Type

Job Location

Education

Branch

A good understanding of semiconductor packaging processes and materials and technology and trends such as PCB design and manufacturing, molding, wire-bonding, die attach, etc.
A good understanding of semiconductor package and SSD system reliability and defects; solder-joint reliability, warpage, etc.

Solid academic knowledge on Solid Mechanics, Design of Machine Elements and Dynamic Analysis (Random Vibration, Impact) concepts,
Experience required in analysis of Mechanical Shock, Drop Test, Random Vibration, Temperature Cycling and warpage conditions of semiconductor IC Packages, Memory Modules, Electronic Systems and PCB assemblies .
Experience required in system assembly analysis using LS-Dyna or other explicit simulation tools.
Hands on experience of software tools such as ANSYS APDL Scripting & Workbench, LS-Dyna and Sherlock Softwares.
Simulation and Scripting techniques to automate the simulation process.
A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
Thorough knowledge of material properties and material property test methods.
Working knowledge through academic coursework or experience in numerical simulation of material and structural behavior (non-linear deformation, viscoelastic behavior, etc.).