Qualcomm Recruitment Drive 2025 | Qualcomm Hiring Mechanical Engineer

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Company Name
Qualcomm
Company Website
https://www.qualcomm.com/
Experience
2+ Years
Job Role
Mechanical Engineer
Job Type
  • Experienced
Job Location
  • Bengaluru/Bangalore
Skills
  • Good Communication Skill
  • CREO
Education
  • PhD degree
  • BE/BTech
  • ME/M.Tech
Branch
  • Mechanical Engineering
Job will expire on
21 Aug 2025

About Company

Qualcomm is a leading American multinational corporation that designs and manufactures semiconductors, software, and services related to wireless technology. Headquartered in San Diego, California, Qualcomm is best known for developing and commercializing 5G, 4G LTE, and other mobile communication technologies.

Job Overview

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Mechanical Engineer, you will design, analyze, troubleshoot, and test electro-mechanical systems and packaging. Qualcomm Engineers collaborate across functions to provide design information and complete project deliverables.

Eligibility Criteria

  • 2+ years actively involved in the mechanical engineering, Thermal Engineering and design of high-density electronics packaging.
  • 2+ years’ experience in a mechanical / Thermal engineering role designing electronics products / systems.
  • Solid modeling experience utilizing Creo, Simulation experience in Flotherm or ANSYS icepak.
  • Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience.
  • Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
  • PhD in Mechanical Engineering or related field.

Job Description

  • Expected to possess a strong understanding of mechanical engineering, thermal engineering and design fundamentals.
  • Experience with defining outline, mounting, and I/O constraints of electronic circuit boards.
  • Demonstrated ability for tolerance analysis and specification, including GD&T fundamentals.
  • Demonstrated success in working with HW, component engineering, and other cross functional teams.
  • Demonstrated success in working with HW and thermal analysis teams for appropriate thermal mitigation techniques.
  • Solid understanding of design fundamentals for CNC, injection molded and stamped metal parts.
  • Demonstrated ability working with supplier base for successful design collaboration and volume production.
  • Strong experience with Creo solid model assembly, part, and drawing creation and Data storage.
  • Experience with top-down skeleton model structuring and master model design techniques within Creo.
  • Experience with IDF/EMN file exchange between mechanical and HW teams.
  • Understands project goals and individual contribution toward those goals.
  • Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
  • Interact and collaborate with other internal mechanical engineers for optimal product development processes and schedule execution.
  • Possess excellent verbal and written communication skills
  • Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

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